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surface mount pin diodes technical data features ? diodes optimized for: low current switching low distortion attenuating ultra-low distortion switching microwave frequency operation ? surface mount sot-23 and sot-143 packages single and dual versions tape and reel options available ? low failure in time (fit) rate [1] note: 1. for more information see the surface mount pin reliability data sheet. hsmp-38xx and hsmp-48xx series package lead code identification common cathode #4 unconnected pair #5 common anode #3 series #2 single #0 dual anode #a dual cathode #b required. the hsmp-48xx series are special products featuring ultra low parasitic inductance in the sot-23 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional sot-23 pin diodes. the hsmp-4810 diode is a low distor- tion attenuating pin designed for operation to 3 ghz. the hsmp-4820 diode is ideal for limiting and low inductance switching applications up to 1.5 ghz. the hsmp-4890 is optimized for low current switch- ing applications up to 3 ghz. the hsmp-386x series of general purpose pin diodes are designed for two classes of applications. the first is attenuators where current consumption is the most important design consideration. the second application for this series of diodes is in switches where low cost is the driving issue for the designer. the hsmp-386x series total capacitance (c t ) and total resistance (r t ) are typical specifications. for applications that require guaranteed perfor- mance, the general purpose hsmp-383x series is recom- mended. for low distortion description/applications the hsmp-380x and hsmp-381x series are specifically designed for low distortion attenuator applica- tions. the hsmp-382x series is optimized for switching applica- tions where ultra-low resistance is required. the hsmp-3880 switch- ing diode is an ultra low distortion device optimized for higher power applications from 50 mhz to 1.5 ghz. the hsmp-389x series is optimized for switching applica- tions where low resistance at low current and low capacitance are attenuators, the hsmp-380x or -381x series are recommended. for high performance switching applications, the hsmp-389x series is recommended. a spice model is not available for pin diodes as spice does not provide for a key pin diode characteristic, carrier lifetime.
2 absolute maximum ratings [1] t a = 25 c symbol parameter units absolute maximum i f forward current (1 ms pulse) amp 1 p t total device dissipation mw [2] 250 p iv peak inverse voltage same as v br t j junction temperature c 150 t stg storage temperature c -65 to 150 notes: 1. operation in excess of any one of these conditions may result in permanent damage to this device. 2. cw power dissipation at t lead = 25 c. derate to zero at maximum rated temperature. pin switching diodes electrical specifications t a = 25 c nearest maximum equivalent minimum maximum maximum shunt mode part package axial lead breakdown series total harmonic number marking lead part no. voltage resistance capacitance distortion hsmp- code [1] code configuration 5082- v br (v) r s ( w )c t (pf) hmd (dbc) 3820 f0 0 single 3188 50 0.6* 0.8* 3822 f2 2 series 3823 f3 3 common anode 3824 f4 4 common cathode 3880 s0 0 single 100 6.5 0.40 C55 3890 g0 0 single 100 2.5 0.30** 3892 g2 2 series 3893 g3 3 common anode 3894 g4 4 common cathode 3895 g5 5 unconnected pair test conditions v r = v br i f = 5 ma v r = 50 v 2 f o, z o = 50 w measure f = 100 mhz f = 1 mhz f o = 400 mhz i r 10 m ai f = 10 ma* v r = 20 v* p in = +30 dbm v r = 5 v** 0 v bias note: 1. package marking code is white. pin attenuator diodes electrical specifications t a = 25 c (each diode) nearest equivalent minimum maximum maximum minimum maximum part package axial lead breakdown series total high low number marking lead part no. voltage resistance capacitance resistance resistance hsmp- code [1] code configuration 5082- v br (v) r s ( w )c t (pf) r h ( w )r l ( w ) 3800 d0 0 single 3080 100 2.0 0.37 1000 8 3802 d2 2 series 3804 d4 4 common cathode 3810 e0 0 single 3081 100 3.0 0.35 1500 10 3812 e2 2 series 3813 e3 3 common anode 3814 e4 4 common cathode test conditions v r = v br i f = 100 ma v r = 50 v i f = 0.01 ma i f = 20 ma measure f = 100 mhz f = 1 mhz f = 100 mhz f= 100 mhz i r 10 m a
3 pin general purpose diodes, electrical specifications t a = 25 c nearest equivalent minimum maximum maximum part package axial lead breakdown series total number marking lead part no. voltage resistance capacitance hsmp- code [1] code configuration 5082- v br (v) r s ( w )c t (pf) 3830 k0 0 single 3077 200 1.5 0.3 3832 k2 2 series 3833 k3 3 common anode 3834 k4 4 common cathode test conditions v r = v br i f = 100 ma v r = 50 v measure f = 100 mhz f = 1 mhz i r 10 ma high frequency (low inductance, 500 mhz C 3 ghz) pin diodes, electrical specifications t a = 25 c minimum maximum typical maximum typical break- series total total total part package down resis- capaci- capaci- induc- number marking lead config- voltage tance tance tance tance appli- hsmp- code code uration v br (v) r s ( w )c t (pf) c t (pf) l t (nh) cation 4810 eb b dual 100 3.0 0.35 0.4 1.0 attenu- cathode ator 4820 fa a dual anode 50 0.6* 0.75* 1.0 1.0* limiter 4890 ga a dual anode 100 2.5** 0.33 0.375 1.0 switch v r = v br i f = 100 ma v r = 50 v v r = 50 v f = 500 mhz C measure i f = 10 ma* f = 1 mhz f = 1 mhz 3 ghz i r 10 m ai f = 5 ma** v r = 20 v* v r = 0 v v r = 20 v* pin general purpose diodes, typical specifications t a = 25 c code minimum typical series typical total part number marking lead breakdown resistance capacitance hsmp- code [1] code configuration voltage v br (v) r s ( w )c t (pf) 3860 l0 0 single 50 3.0/1.5* 0.20 3862 l2 2 series 3863 l3 3 common anode 3864 l4 4 common cathode test conditions v r = v br i f = 10 ma v r = 50 v measure f = 100 mhz f = 1 mhz i r 10 m a *i f = 100 ma typical parameters at t a = 25 c part number series resistance carrier lifetime reverse recovery time total capacitance hsmp- r s ( w ) t (ns) t rr (ns) c t (pf) 380x 55 1800 500 0.32 @ 50 v 381x 75 1500 300 0.27 @ 50 v 382x 1.5 70* 7 0.60 @ 20 v 383x 20 500 80 0.20 @ 50 v 388x 3.8 2500 550 0.30 @ 50 v 389x 3.8 200* C 0.20 @ 5 v test conditions i f = 1 ma i f = 50 ma v r = 10 v f = 100 mhz i r = 250 ma i f = 20 ma i f = 10 ma* i f = 10 ma* 90% recovery i r = 6 ma* note: 1. package marking code is white.
4 typical parameters at t a = 25 c (unless otherwise noted), single diode figure 2. rf capacitance vs. reverse bias, hsmp-3830 series. 0.15 0.30 0.25 0.20 0.35 0.40 0.45 02 6 41012 816 14 18 20 total capacitance (pf) reverse voltage (v) figure 1. rf capacitance vs. reverse bias, hsmp-3810 series. figure 3. resistance at 25 c vs. forward bias current. 1 mhz 30 mhz frequency>100 mhz 0.15 0.30 0.25 0.20 0.35 02 6 41012 816 14 18 20 total capacitance (pf) reverse voltage (v) 1 ghz 100 mhz 1 mhz 10000 1000 100 10 1 0.1 resistance (ohms) i f ?forward bias current (ma) 0.01 0.1 1 10 100 3000 1000 100 10 1 0.01 0.1 1 10 100 rf resistance (ohms) i f ?forward bias current (ma) t a = +85 c t a = +25 c t a = 55 c 10000 1000 100 10 1 rf resistance (ohms) 0.01 0.1 1 10 100 i f ?forward bias current (ma) t a = +85 c t a = +25 c t a = 55 c figure 5. rf resistance vs. forward bias current for hsmp-3810/ hsmp-4810. 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 1020304050 v r ?reverse voltage (v) capacitance (pf) hsmp-382x hsmp-3880 hsmp-3800 hsmp-3890 hsmp-381x hsmp-3830 figure 6. capacitance vs. reverse voltage. figure 4. rf resistance vs. forward bias current for hsmp-3800. 120 110 100 90 80 70 60 50 40 1000 100 10 diode mounted as a series attenuator in a 50 ohm microstrip and tested at 123 mhz diode rf resistance (ohms) figure 7. 2nd harmonic input intercept point vs. diode rf resistance for attenuator diodes. input intercept point (dbm) hsmp-3810 hsmp-3830 hsmp-3830 120 115 110 105 100 95 90 85 11030 i f ?forward bias current (ma) figure 8. 2nd harmonic input intercept point vs. forward bias current for switch diodes. input intercept point (dbm) hsmp-3880 hsmp-3820 hsmp-3880 hsmp-3830 hsmp-3890 diode mounted as a series attenuator in a 50 ohm microstrip and tested at 123 mhz forward current (ma) figure 9. reverse recovery time vs. forward current for various reverse voltages. hsmp-3820 series. t rr ?reverse recovery time (ns) 1 10 100 10 20 30 v r = 2 v v r = 5 v v r = 10 v hsmp-382x hsmp-381x, /hsmp-4810 hsmp-382x, -4820 hsmp-383x, -386x
5 typical parameters (continued) 1000 100 10 10 20 30 t rr - reverse recovery time (ns) forward current (ma) figure 10. reverse recovery time vs. forward current for various reverse voltage. hsmp-3830 series. hsmp-3830 v r = 5v v r = 10v v r = 20v 1000 900 800 400 100 10 20 25 15 30 reverse recovery time (ns) forward current (ma) figure 11. typical reverse recovery time vs. reverse voltage. hsmp-3880 series. 700 600 500 200 300 v r = 5 v v r = 10 v v r = 20 v 200 160 120 80 40 0 10 20 15 25 30 t rr - reverse recovery time (ns) forward current (ma) figure 12. typical reverse recovery time vs. reverse voltage. hsmp-3890 series. v r = 2 v v r = 5 v v r = ?0 v 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 13. forward current vs. forward voltage. hsmp-3800 series. 125 c 25 c ?0 c hsmp-3800 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 14. forward current vs. forward voltage. hsmp-3810 and hsmp-4810 series. hsmp-3810 hsmp-4810 125 c 25 c ?0 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 15. forward current vs. forward voltage. hsmp-3820 and hsmp-4820 series. hsmp-382x hsmp-482x 125 c 25 c ?0 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 16. forward current vs. forward voltage. hsmp-3830 series. hsmp-3830 125 c 25 c ?0 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward current (ma) figure 17. forward current vs. forward voltage. hsmp-3880 series. 125 c 25 c ?5 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 18. forward current vs. forward voltage. hsmp-3890 and hsmp-4890 series. 25 c 125 c ?5 c
6 typical parameters (continued) figure 19. typical rf resistance vs. forward bias current for hsmp-3860. figure 20. forward current vs. forward voltage for hsmp-3860. figure 21. typical capacitance vs. reverse bias for hsmp-3860. 0.01 100 1000 1 10 resistance (ohms) bias current (ma) 10 100 1 0.1 0 1.2 100 0.01 1.0 i f ?forward current (ma) v f ?forward voltage (v) 1 10 0.6 0.2 0.4 0.8 0.1 020 0.5 0 15 c t ?capacitance (pf) v r ?reverse voltage (v) 0.2 0.4 10 5 0.1 0.3 t a = +125 c t a = +25 c t a = 50 c t a = +85 c t a = +25 c t a = 55 c 0.12 pf* * measured at -20 v 1.5 r j r s l p c p 0.08 pf c j 2.0 nh r j = 12 i 0.9 r t = 1.5 + r j c t = c p + c j i = forward bias current in ma equivalent circuit model hsms-3860
7 typical applications for multiple diode products rf common rf common rf 1 bias 1 bias bias rf 2 bias 2 figure 22. simple spdt switch, using only positive current. rf common rf 1 rf 2 bias figure 24. switch using both positive and negative bias current. figure 25. very high isolation spdt switch, dual bias. figure 23. high isolation spdt switch, dual bias. rf 2 rf 1 rf common rf 2 rf 1 bias
8 typical applications for multiple diode products (continued) input rf in/out figure 26. four diode p attenuator. figure 27. high isolation spst switch (repeat cells as required). fixed bias voltage variable bias bias figure 28. power limiter using hsmp-3822 diode pair.
9 typical applications for hsmp-48xx low inductance series 12 12 3 12 3 figure 29. internal connections. hsmp-4820 & hsmp-4890 hsmp-4810 3 0.5 nh 0.5 nh 0.3 pf* 0.5nh *0.8pf typical for hsmp-3820 figure 30. equivalent circuit. *0.8 pf typical for hsmp-3820 figure 32. equivalent circuit. figure 31. circuit layout. 0.25 nh 0.5 nh 0.3 pf* microstrip series connection for hsmp-48xx series in order to take full advantage of the low inductance of the hsmp-48xx series when using them in series application, both lead 1 and lead 2 should be connected together, as shown above.
10 microstrip shunt connections for hsmp-48xx series in the diagram above, the center conductor of the microstrip line is interrupted and leads 1 and 2 of the hsmp-38xx series diode are placed across the resulting gap. this forces the 0.5 nh lead inductance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and increasing the maximum available attenuation. the 0.3 nh of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material. co-planar waveguide shunt connection for hsmp-48xx series co-planar waveguide, with ground on the top side of the printed circuit board, is shown in the diagram above. since it eliminates the need for via holes to ground, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit. 50 ohm microstrip lines pad connected to ground by two via holes 0.3 nh 0.3 nh 0.3 pf* 1.5 nh 1.5 nh *0.8 pf typical for hsmp-4820 figure 34. equivalent circuit. figure 33. circuit layout. *0.8 pf typical for hsmp-4820 figure 36. equivalent circuit. figure 35. circuit layout. co-planar waveguide groundplane center conductor groundplane 0.3 pf* 0.75 nh
11 package dimensions outline 23 (sot-23) pc board footprints sot-23 0.037 0.95 0.037 0.95 0.079 2.0 0.031 0.8 dimensions in inches mm 0.035 0.9 package characteristics lead material ...................................................................................... alloy 42 lead finish ............................................................................ tin-lead 85-15% maximum soldering temperature .............................. 260 c for 5 seconds minimum lead strength .......................................................... 2 pounds pull typical package inductance .................................................................. 2 nh typical package capacitance .............................. 0.08 pf (opposite leads) sot-143 dimensions in inches mm 0.075 1.9 0.071 1.8 0.112 2.85 0.079 2 0.033 0.85 0.041 1.05 0.108 2.75 0.033 0.85 0.047 1.2 0.031 0.8 0.033 0.85 outline 143 (sot-143) 3 1 2 side view top view end view dimensions are in millimeters (inches) 1.02 (0.040) 0.89 (0.035) 0.50 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) x x x package marking code (xx) date code (x) 0.69 (0.027) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 0.60 (0.024) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) 0.10 (0.004) 0.013 (0.0005) 1.04 (0.041) 0.85 (0.033) 0.92 (0.036) 0.78 (0.031) 2.04 (0.080) 1.78 (0.070) dimensions are in millimeters (inches) 0.15 (0.006) 0.09 (0.003) 3.06 (0.120) 2.80 (0.110) package marking code (xx) be c e x x x date code (x)
www.hp.com/go/rf for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1999 hewlett-packard co. obsoletes 5968-3435e 5968-5439e (6/99) profile option descriptions -blk = bulk -tr1 = 3k pc. tape and reel, device orientation; see figures 37 and 38 -tr2 = 10k pc. tape and reel, device orientation; see figures 37 and 38 tape and reeling conforms to electronic industries rs-481, taping of surface mounted components for automated placement. ordering information specify part number followed by option under. for example: h smp - 38xx - xxx bulk or tape and reel option part number surface mount pin diode hewlett-packard user feed direction cover tape carrier tape reel end view 8 mm 4 mm top view figure 37. options -tr1, -tr2 for sot-23 packages. figure 38. options -tr1, -tr2 for sot-143 packages. end view 8 mm 4 mm top view

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